Product Specifications

  • Die Grade: Good Die(Tier1)
  • Size : 12x18x1.3mm
  • Package Type: 132Ball FBGA
NAND

FLASH MEMORY

NAND Type Stacking Process Operating Temp Capacity (Package) Data Transfer
3D-TLC V5 /V6 0°C ~ 70°C 128GB/256GB/512GB/1TB Up to 1,200Mbps
  • Form Factor: 20x24x2.0mm
  • Package Type: 319Ball FBGA
BGA SSD

BGA SSD (Under Development)

Interface Seq Read(MB/s) Seq Write(MB/s) Capacity PMIC
PCIe Gen4 Up to 5,000MB/s Up to 4,000MB/s 256GB/512GB/1TB Included inside